{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9653338","patent":{"patent_number":"US-9653338","title":"System and method for non-contact wafer chucking","assignee":null,"inventors":[],"filing_date":"2014-12-15T00:00:00.000Z","publication_date":"2017-05-16T00:00:00.000Z","cpc_codes":["H01L","G01N","H01L","G01N"],"num_claims":37,"abstract":"A non-contact wafer chucking apparatus includes a wafer chuck and a gripper assembly coupled to a portion of the wafer chuck. The wafer chuck includes pressurized gas elements configured to generate pressurized gas regions across a surface of the wafer chuck suitable for elevating the wafer above the surface of the wafer chuck. The wafer chuck further includes vacuum elements configured to generate reduced pressure regions across the surface of the wafer chuck having a pressure lower than the pressurized gas regions. The reduced pressure regions are suitable for securing the wafer above the wafer chuck without contact to the wafer chuck. The chucking apparatus includes a rotational drive unit configured to selectively rotate the wafer chuck. The gripper elements are reversibly couplable to an edge portion of the wafer so as to secure the wafer such that the wafer and gripper assembly rotate synchronously with the wafer chuck."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"System and method for non-contact wafer chucking","description":"A non-contact wafer chucking apparatus includes a wafer chuck and a gripper assembly coupled to a portion of the wafer chuck. The wafer chuck includes pressurized gas elements configured to generate p","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9653338","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9653338","citation_suggestion":"Patentable. \"System and method for non-contact wafer chucking\" (US-9653338). https://patentable.app/patents/US-9653338","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9653338","json":"https://patentable.app/api/llm-context/US-9653338","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:21:59.490Z"}