{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9653401","patent":{"patent_number":"US-9653401","title":"Method for forming buried conductive line and structure of buried conductive line","assignee":null,"inventors":[],"filing_date":"2012-04-11T00:00:00.000Z","publication_date":"2017-05-16T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":7,"abstract":"A method for forming a buried conductive line is described. A substrate having a trench therein and a contact area thereon is provided, wherein the trench has an end portion in the contact area and a conductive layer is filled in the trench. A mask layer is formed covering the conductive layer in the contact area. The conductive layer is etched back using the mask layer as a mask."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for forming buried conductive line and structure of buried conductive line","description":"A method for forming a buried conductive line is described. A substrate having a trench therein and a contact area thereon is provided, wherein the trench has an end portion in the contact area and a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9653401","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9653401","citation_suggestion":"Patentable. \"Method for forming buried conductive line and structure of buried conductive line\" (US-9653401). https://patentable.app/patents/US-9653401","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9653401","json":"https://patentable.app/api/llm-context/US-9653401","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:52:31.147Z"}