{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9653407","patent":{"patent_number":"US-9653407","title":"Semiconductor device packages","assignee":null,"inventors":[],"filing_date":"2015-07-02T00:00:00.000Z","publication_date":"2017-05-16T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"The present disclosure relates to a semiconductor device package and a method for manufacturing the semiconductor device package. The semiconductor device package includes a substrate, a grounding element, a component, a package body and a conductive layer. The grounding element is disposed in the substrate and includes a connection surface exposed at a second portion of a lateral surface of the substrate. The component is disposed on a top surface of the substrate. The package body covers the component and the top surface of the substrate. A lateral surface of the package body is aligned with the lateral surface of the substrate. The conductive layer covers a top surface and the lateral surface of the package body, and further covers the second portion of the lateral surface of the substrate. A first portion of the lateral surface of the substrate is exposed from the conductive layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device packages","description":"The present disclosure relates to a semiconductor device package and a method for manufacturing the semiconductor device package. The semiconductor device package includes a substrate, a grounding ele","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9653407","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9653407","citation_suggestion":"Patentable. \"Semiconductor device packages\" (US-9653407). https://patentable.app/patents/US-9653407","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9653407","json":"https://patentable.app/api/llm-context/US-9653407","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:18:32.317Z"}