{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9653421","patent":{"patent_number":"US-9653421","title":"Semiconductor device","assignee":null,"inventors":[],"filing_date":"2015-04-07T00:00:00.000Z","publication_date":"2017-05-16T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A semiconductor device is provided with: a semiconductor chip die-bonding mounted face up on a support; an intermediate substrate connecting the semiconductor chip to a plurality of external connection portions; and a plurality of connection bumps connecting the semiconductor chip and the intermediate substrate. The plurality of connection bumps includes a plurality of power supply bumps connected to a plurality of electrode pads on the semiconductor chip for supplying power to the semiconductor chip. The intermediate substrate includes: a plurality of power supply pads connected to the plurality of electrode pads through the plurality of power supply bumps; a bump surface facing the semiconductor chip and having a plurality of power supply pads formed thereon; an external connection surface having a plurality of external connection pads formed thereon connected to the external connection portions; and a capacitor connected to the plurality of power supply bumps."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device","description":"A semiconductor device is provided with: a semiconductor chip die-bonding mounted face up on a support; an intermediate substrate connecting the semiconductor chip to a plurality of external connectio","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9653421","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9653421","citation_suggestion":"Patentable. \"Semiconductor device\" (US-9653421). https://patentable.app/patents/US-9653421","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9653421","json":"https://patentable.app/api/llm-context/US-9653421","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:33:34.805Z"}