{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9653540","patent":{"patent_number":"US-9653540","title":"Semiconductor wafer and method of manufacturing semiconductor devices in a semiconductor wafer","assignee":null,"inventors":[],"filing_date":"2016-05-04T00:00:00.000Z","publication_date":"2017-05-16T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A method of manufacturing semiconductor devices in a semiconductor wafer comprises forming charge compensation device structures in the semiconductor wafer. An electric characteristic related to the charge compensation device structures is measured. At least one of proton irradiation and annealing parameters are adjusted based on the measured electric characteristic. The semiconductor wafer is irradiated with protons and annealed based on the at least one of the adjusted proton irradiation and annealing parameters. Laser beam irradiation parameters are adjusted with respect to different positions on the semiconductor wafer based on the measured electric characteristic. The semiconductor wafer is irradiated with a photon beam at the different positions on the wafer based on the photon beam irradiation parameters."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor wafer and method of manufacturing semiconductor devices in a semiconductor wafer","description":"A method of manufacturing semiconductor devices in a semiconductor wafer comprises forming charge compensation device structures in the semiconductor wafer. An electric characteristic related to the c","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9653540","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9653540","citation_suggestion":"Patentable. \"Semiconductor wafer and method of manufacturing semiconductor devices in a semiconductor wafer\" (US-9653540). https://patentable.app/patents/US-9653540","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9653540","json":"https://patentable.app/api/llm-context/US-9653540","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:35:28.626Z"}