{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9658275","patent":{"patent_number":"US-9658275","title":"De-embedding on-wafer devices","assignee":null,"inventors":[],"filing_date":"2015-07-14T00:00:00.000Z","publication_date":"2017-05-23T00:00:00.000Z","cpc_codes":["G11C","H01L","G11C"],"num_claims":18,"abstract":"An apparatus includes three components. The first component includes a first transmission line; the second component is coupled with the first component and includes a second transmission line; and the third component electrically coupled with the first component and/or the second component. The transmission lines each include a substrate with a p-well or n-well within the substrate and a shielding layer over the p-well or n-well. The transmission lines also each include a plurality of intermediate conducting layers over the shielding layer, the plurality of intermediate conducting layers coupled by a plurality of vias. The transmission lines further each include a top conducting layer over the plurality of intermediate conducting layers."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"De-embedding on-wafer devices","description":"An apparatus includes three components. The first component includes a first transmission line; the second component is coupled with the first component and includes a second transmission line; and th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9658275","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9658275","citation_suggestion":"Patentable. \"De-embedding on-wafer devices\" (US-9658275). https://patentable.app/patents/US-9658275","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9658275","json":"https://patentable.app/api/llm-context/US-9658275","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:24:03.402Z"}