{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9659115","patent":{"patent_number":"US-9659115","title":"Thermal analysis for tiered semiconductor structure","assignee":null,"inventors":[],"filing_date":"2013-12-19T00:00:00.000Z","publication_date":"2017-05-23T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F","G06F","G06F"],"num_claims":20,"abstract":"Among other things, one or more systems and techniques for analyzing a tiered semiconductor structure are provided. One or more segments are defined for the tiered semiconductor structure. The one or more segments are iteratively evaluated during electrical simulation while taking into account thermal properties to determine power metrics for the segments. The power metrics are used to determine temperatures generated by integrated circuitry within the segments. Responsive to a segment having a temperature above a temperature threshold, a temperature action plan, such as providing an alert or inserting one or more thermal release structures into the segment, is implemented. In this way, the one or more segments are iteratively evaluated to identify and resolve thermal and reliability issues."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Thermal analysis for tiered semiconductor structure","description":"Among other things, one or more systems and techniques for analyzing a tiered semiconductor structure are provided. One or more segments are defined for the tiered semiconductor structure. The one or ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9659115","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9659115","citation_suggestion":"Patentable. \"Thermal analysis for tiered semiconductor structure\" (US-9659115). https://patentable.app/patents/US-9659115","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9659115","json":"https://patentable.app/api/llm-context/US-9659115","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:57:57.939Z"}