{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9659851","patent":{"patent_number":"US-9659851","title":"Method and apparatus for improving the reliability of a connection to a via in a substrate","assignee":null,"inventors":[],"filing_date":"2015-02-03T00:00:00.000Z","publication_date":"2017-05-23T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"Some of the embodiments of the present disclosure provide a semiconductor package interposer comprising a substrate having a first surface and a second surface, a plurality of vias extending between the first surface and the second surface of the substrate, the plurality of vias electrically connecting electrical connectors or circuitry on the first surface of the substrate to electrical connectors or circuitry on the second surface of the substrate, and metal plugs at least partially filling the plurality of vias. At least one of (i) the first surface or (ii) the second surface of the substrate includes depressions at distal ends of the metal plugs."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method and apparatus for improving the reliability of a connection to a via in a substrate","description":"Some of the embodiments of the present disclosure provide a semiconductor package interposer comprising a substrate having a first surface and a second surface, a plurality of vias extending between t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9659851","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9659851","citation_suggestion":"Patentable. \"Method and apparatus for improving the reliability of a connection to a via in a substrate\" (US-9659851). https://patentable.app/patents/US-9659851","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9659851","json":"https://patentable.app/api/llm-context/US-9659851","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:43:27.618Z"}