{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9659854","patent":{"patent_number":"US-9659854","title":"Embedded packaging for devices and systems comprising lateral GaN power transistors","assignee":null,"inventors":[],"filing_date":"2015-04-15T00:00:00.000Z","publication_date":"2017-05-23T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"Embedded packaging for devices and systems comprising lateral GaN power transistors is disclosed. The packaging assembly is suitable for large area, high power GaN transistors and comprises an assembly of a GaN power transistor and package components comprising a three level interconnect structure. In preferred embodiments, the three level interconnect structure comprises an on-chip metal layer, a copper redistribution layer and package metal layers, in which there is a graduated or tapered contact area sizing through the three levels for dividing/applying current on-chip and combining/collecting current off-chip, with distributed contacts over the active area of the GaN power device. This embedded packaging assembly provides a low inductance, low resistance interconnect structure suitable for devices and systems comprising large area, high power GaN transistors for high voltage/high current applications."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Embedded packaging for devices and systems comprising lateral GaN power transistors","description":"Embedded packaging for devices and systems comprising lateral GaN power transistors is disclosed. The packaging assembly is suitable for large area, high power GaN transistors and comprises an assembl","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9659854","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9659854","citation_suggestion":"Patentable. \"Embedded packaging for devices and systems comprising lateral GaN power transistors\" (US-9659854). https://patentable.app/patents/US-9659854","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9659854","json":"https://patentable.app/api/llm-context/US-9659854","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:40:13.298Z"}