{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9659878","patent":{"patent_number":"US-9659878","title":"Wafer level shielding in multi-stacked fan out packages and methods of forming same","assignee":null,"inventors":[],"filing_date":"2015-10-20T00:00:00.000Z","publication_date":"2017-05-23T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An embodiment device package includes a device die, a molding compound surrounding the device die, a conductive through inter-via (TIV) extending through the molding compound, and an electromagnetic interference (EMI) shield disposed over and extending along sidewalls of the molding compound. The EMI shield contacts the conductive TIV, and the conductive TIV electrically connects the EMI shield to an external connector. The external connector and the EMI shield are disposed on opposing sides of the device die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer level shielding in multi-stacked fan out packages and methods of forming same","description":"An embodiment device package includes a device die, a molding compound surrounding the device die, a conductive through inter-via (TIV) extending through the molding compound, and an electromagnetic i","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9659878","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9659878","citation_suggestion":"Patentable. \"Wafer level shielding in multi-stacked fan out packages and methods of forming same\" (US-9659878). https://patentable.app/patents/US-9659878","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9659878","json":"https://patentable.app/api/llm-context/US-9659878","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:20:55.286Z"}