{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9659881","patent":{"patent_number":"US-9659881","title":"Semiconductor structure including a substrate and a semiconductor chip with matching coefficients of thermal expansion","assignee":null,"inventors":[],"filing_date":"2014-09-19T00:00:00.000Z","publication_date":"2017-05-23T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes: a substrate comprising a recess portion filled with a conductive material; a conductive trace overlying and contacting the conductive material; a conductive pillar disposed on the conductive trace and over the recess portion of the substrate; and a semiconductor chip disposed on the conductive pillar, wherein the elastic modulus of the substrate is of about 3 to about 10 GPa at about 20 to about 30° C. and of about 1 to about 5 GPa at about 250 to about 270° C."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor structure including a substrate and a semiconductor chip with matching coefficients of thermal expansion","description":"A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes: a substrate comprising a recess portion filled with a conductive material; a conductive ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9659881","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9659881","citation_suggestion":"Patentable. \"Semiconductor structure including a substrate and a semiconductor chip with matching coefficients of thermal expansion\" (US-9659881). https://patentable.app/patents/US-9659881","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9659881","json":"https://patentable.app/api/llm-context/US-9659881","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:44:10.529Z"}