{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9659883","patent":{"patent_number":"US-9659883","title":"Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package","assignee":null,"inventors":[],"filing_date":"2014-09-09T00:00:00.000Z","publication_date":"2017-05-23T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150° C. for 1 hour is 125° C. or higher, and a thermal expansion coefficient α [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E′ [GPa] at 25° C. of the thermally cured product satisfy the following formula (2):30≦Ea≦120 [kJ/mol]  (1); and10,000≦α×E′≦300,000 [Pa/K]  (2)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package","description":"The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volum","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9659883","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9659883","citation_suggestion":"Patentable. \"Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package\" (US-9659883). https://patentable.app/patents/US-9659883","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9659883","json":"https://patentable.app/api/llm-context/US-9659883","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:00:56.364Z"}