{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9659905","patent":{"patent_number":"US-9659905","title":"Semiconductor package and semiconductor system including the same","assignee":null,"inventors":[],"filing_date":"2015-03-25T00:00:00.000Z","publication_date":"2017-05-23T00:00:00.000Z","cpc_codes":["H01L","G11C","G11C","G11C","G11C","G11C","G11C","H01L","H01L"],"num_claims":17,"abstract":"A semiconductor package may include a first die, a second die disposed adjacent to the first die, and configured to share an address with the first die. The semiconductor package may include a first address pin included with the first die, and configured for receiving the address. The semiconductor package may include a second address pin included with the second die, and configured for receiving the address. The first die and the second die may output data corresponding to the address. Timings of the address in the first die and the second die may be aligned according to delay signals applied from a controller."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and semiconductor system including the same","description":"A semiconductor package may include a first die, a second die disposed adjacent to the first die, and configured to share an address with the first die. The semiconductor package may include a first a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9659905","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9659905","citation_suggestion":"Patentable. \"Semiconductor package and semiconductor system including the same\" (US-9659905). https://patentable.app/patents/US-9659905","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9659905","json":"https://patentable.app/api/llm-context/US-9659905","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:52:31.683Z"}