{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9659913","patent":{"patent_number":"US-9659913","title":"LED module and LED module packaging structure","assignee":null,"inventors":[],"filing_date":"2015-05-22T00:00:00.000Z","publication_date":"2017-05-23T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":46,"abstract":"An LED module includes: a substrate including main, rear, and bottom surfaces; a first light emitting element disposed on the main surface; a conductive layer formed on the substrate and electrically coupled with the first light emitting element; a first conductive bonding layer interposed between the first light emitting element and the conductive layer; a main surface insulating film formed on the main surface and covering a portion of the conductive layer; and a first wire, wherein the main surface and the rear surface face opposite directions, the bottom surface connects long sides of the main and rear surfaces, the conductive layer includes a first wire bonding portion where the first wire is bonded, and the main surface insulating film includes a first insulating portion including a portion interposed between the first light emitting element and the first wire bonding portion when viewed in a thickness direction of the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"LED module and LED module packaging structure","description":"An LED module includes: a substrate including main, rear, and bottom surfaces; a first light emitting element disposed on the main surface; a conductive layer formed on the substrate and electrically ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9659913","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9659913","citation_suggestion":"Patentable. \"LED module and LED module packaging structure\" (US-9659913). https://patentable.app/patents/US-9659913","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9659913","json":"https://patentable.app/api/llm-context/US-9659913","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:52:25.294Z"}