{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9661756","patent":{"patent_number":"US-9661756","title":"Nano-copper pillar interconnects and methods thereof","assignee":null,"inventors":[],"filing_date":"2014-08-08T00:00:00.000Z","publication_date":"2017-05-23T00:00:00.000Z","cpc_codes":["G06K","H01L","H01L","H01L","H01L","H04B"],"num_claims":15,"abstract":"Embodiments of the present invention relate to nano-copper pillar interconnects. Nano-copper material is a mixture of nano-copper particles and one or more organic fluxes. In some embodiments, the one or more organic fluxes include organic solvents that help bind the nano-copper particles together and allow the nano-copper material to be printable. The nano-copper material is applied onto bond pads on a printed circuit board (PCB) via a printing process, a dipping process or the like, to form nano-copper covered PCB bond pads. A component can thereafter be coupled with the PCB at the nano-copper covered PCB bond pads. What is left when the solvents evaporate are nano-copper pillar interconnects that form, coupling the component with the PCB bond pads. The nano-copper pillar interconnects are of pure copper."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Nano-copper pillar interconnects and methods thereof","description":"Embodiments of the present invention relate to nano-copper pillar interconnects. Nano-copper material is a mixture of nano-copper particles and one or more organic fluxes. In some embodiments, the one","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9661756","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9661756","citation_suggestion":"Patentable. \"Nano-copper pillar interconnects and methods thereof\" (US-9661756). https://patentable.app/patents/US-9661756","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9661756","json":"https://patentable.app/api/llm-context/US-9661756","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:50:41.871Z"}