{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9663352","patent":{"patent_number":"US-9663352","title":"Microelectromechanical device and a method of manufacturing","assignee":null,"inventors":[],"filing_date":"2014-05-06T00:00:00.000Z","publication_date":"2017-05-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A microelectromechanical device that comprises a wafer plate, a group of one or more wafer connector elements, and an electrical distribution layer between them. For reduced device thickness, the wafer plate comprises at least two dies and bonding material that bonds the at least two dies alongside each other to the longitudinal extent of the wafer plate, wherein at least one of the dies is a microelectromechanical die. The electrical distribution layer covers the wafer plate and includes a layer of dielectric material and a layer of conductive material, wherein the layer of conductive material is patterned within the layer of dielectric material for electrical interconnection of the dies and the wafer connector elements. With the new configuration, significantly reduced MEMS device thicknesses are achieved."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Microelectromechanical device and a method of manufacturing","description":"A microelectromechanical device that comprises a wafer plate, a group of one or more wafer connector elements, and an electrical distribution layer between them. For reduced device thickness, the wafe","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9663352","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9663352","citation_suggestion":"Patentable. \"Microelectromechanical device and a method of manufacturing\" (US-9663352). https://patentable.app/patents/US-9663352","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9663352","json":"https://patentable.app/api/llm-context/US-9663352","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:40:23.966Z"}