{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9664546","patent":{"patent_number":"US-9664546","title":"Thermal airflow sensor","assignee":null,"inventors":[],"filing_date":"2013-06-10T00:00:00.000Z","publication_date":"2017-05-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"An object of the present invention is to improve the reliability of a product in which a semiconductor device is partially exposed when sealed with resin. In achieving the above object and according to this invention, there is provided a thermal airflow sensor including: a semiconductor substrate having a thin-wall portion, a heating resistor provided over the thin-wall portion, and resistance temperature detectors installed upstream and downstream of the heating resistor; a protective film provided over the semiconductor substrate; and a resin that seals the semiconductor substrate, the resin further including an exposure portion for partially exposing an area including the thin-wall portion. The protective film is provided in a manner seamlessly enclosing the heating resistor, the protective film having an outer peripheral edge located outside the thin-wall portion and over the exposure portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Thermal airflow sensor","description":"An object of the present invention is to improve the reliability of a product in which a semiconductor device is partially exposed when sealed with resin. In achieving the above object and according t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9664546","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9664546","citation_suggestion":"Patentable. \"Thermal airflow sensor\" (US-9664546). https://patentable.app/patents/US-9664546","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9664546","json":"https://patentable.app/api/llm-context/US-9664546","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:31:38.516Z"}