{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9666240","patent":{"patent_number":"US-9666240","title":"Semiconductor device with decreased overlapping area between redistribution lines and signal lines","assignee":null,"inventors":[],"filing_date":"2016-02-24T00:00:00.000Z","publication_date":"2017-05-30T00:00:00.000Z","cpc_codes":["G11C","G11C","G11C","G11C","G11C","G11C","G11C","H01L","H01L","H01L","G11C","G11C","G11C","G11C","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device includes, a semiconductor chip having a first surface over which bonding pads are positioned, a second surface which faces away from the first surface, and a plurality of signal lines formed over the first surface, extending in a first direction; a plurality of redistribution lines formed over the first surface, having one set of ends electrically coupled to the bonding pads of the semiconductor chip, and extending in a direction oblique to the first direction; and a plurality of redistribution pads disposed over the first surface, and electrically coupled with an other set of ends of the redistribution lines which face away from the one set of ends."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device with decreased overlapping area between redistribution lines and signal lines","description":"A semiconductor device includes, a semiconductor chip having a first surface over which bonding pads are positioned, a second surface which faces away from the first surface, and a plurality of signal","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9666240","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9666240","citation_suggestion":"Patentable. \"Semiconductor device with decreased overlapping area between redistribution lines and signal lines\" (US-9666240). https://patentable.app/patents/US-9666240","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9666240","json":"https://patentable.app/api/llm-context/US-9666240","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:39:15.349Z"}