{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9666453","patent":{"patent_number":"US-9666453","title":"Semiconductor package and a substrate for packaging","assignee":null,"inventors":[],"filing_date":"2012-07-11T00:00:00.000Z","publication_date":"2017-05-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"A semiconductor package is provided, which includes: a substrate having a metal pattern layer; a semiconductor die formed on the substrate; and an underfill filled between the substrate and the semiconductor die. At least an opening is formed in the metal pattern layer to reduce the area of the metal pattern layer on the substrate, thereby reducing the contact area between the underfill and the metal pattern layer, hence eliminating the underfill delamination."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and a substrate for packaging","description":"A semiconductor package is provided, which includes: a substrate having a metal pattern layer; a semiconductor die formed on the substrate; and an underfill filled between the substrate and the semico","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9666453","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9666453","citation_suggestion":"Patentable. \"Semiconductor package and a substrate for packaging\" (US-9666453). https://patentable.app/patents/US-9666453","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9666453","json":"https://patentable.app/api/llm-context/US-9666453","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:39:23.090Z"}