{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9666501","patent":{"patent_number":"US-9666501","title":"Semiconductor device including a lead frame","assignee":null,"inventors":[],"filing_date":"2010-10-20T00:00:00.000Z","publication_date":"2017-05-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":33,"abstract":"A semiconductor device including a die pad having a front surface made of Cu; a semiconductor chip disposed so as to be opposed to the front surface of the die pad; a bonding layer provided between the die pad and the semiconductor chip; and a plurality of leads disposed around the die pad, wherein the die pad and the plurality of leads make up a lead frame in cooperation with each other, a cavity is fabricated on the surface of the plurality of leads, and a projecting portion is fabricated next to the cavity."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device including a lead frame","description":"A semiconductor device including a die pad having a front surface made of Cu; a semiconductor chip disposed so as to be opposed to the front surface of the die pad; a bonding layer provided between th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9666501","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9666501","citation_suggestion":"Patentable. \"Semiconductor device including a lead frame\" (US-9666501). https://patentable.app/patents/US-9666501","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9666501","json":"https://patentable.app/api/llm-context/US-9666501","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T18:30:59.854Z"}