{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9666512","patent":{"patent_number":"US-9666512","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2015-05-12T00:00:00.000Z","publication_date":"2017-05-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":21,"abstract":"A semiconductor package with a leadframe to mount a transistor device prevents malfunction. The semiconductor package includes a leadframe including at least one or more transistor die attach pads where a first transistor device and a second transistor device are arranged, a driver die attach pad where a driver semiconductor chip is arranged, a first driver lead electrically connected to the driver semiconductor chip, and a second driver lead arranged between the first driver lead and the at least one or more transistor die attach pads, a chip bonding wire electrically connecting the first transistor device with the driver semiconductor chip, a first transistor bonding wire electrically connecting the first driver lead with the second transistor device, and a first insulator arranged on the second driver lead to insulate the second driver lead and the first transistor bonding wire from each other."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package","description":"A semiconductor package with a leadframe to mount a transistor device prevents malfunction. The semiconductor package includes a leadframe including at least one or more transistor die attach pads whe","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9666512","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9666512","citation_suggestion":"Patentable. \"Semiconductor package\" (US-9666512). https://patentable.app/patents/US-9666512","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9666512","json":"https://patentable.app/api/llm-context/US-9666512","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:20:10.257Z"}