{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9666534","patent":{"patent_number":"US-9666534","title":"Semiconductor interconnect structure and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2014-05-13T00:00:00.000Z","publication_date":"2017-05-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"The present disclosure provides an interconnect structure, including a low k dielectric layer with an air gap region and a non-air gap region. A first conductive line is positioned in the air gap region, and a second conductive line is positioned in the non-air gap region of the low k dielectric layer. A height of the first conductive line is different from a height of the second conductive line. The present disclosure also provides a method for manufacturing a semiconductor interconnect structure, including forming a photoresist layer over a hard mask layer with openings exposing a low k dielectric layer; treating the low k dielectric layer to be more hydrophilic through the openings of the hard mask layer; and removing the treated low k dielectric region to form an air gap in the air gap region."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor interconnect structure and manufacturing method thereof","description":"The present disclosure provides an interconnect structure, including a low k dielectric layer with an air gap region and a non-air gap region. A first conductive line is positioned in the air gap regi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9666534","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9666534","citation_suggestion":"Patentable. \"Semiconductor interconnect structure and manufacturing method thereof\" (US-9666534). https://patentable.app/patents/US-9666534","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9666534","json":"https://patentable.app/api/llm-context/US-9666534","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:42:11.275Z"}