{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9666542","patent":{"patent_number":"US-9666542","title":"Wiring substrate and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2014-09-24T00:00:00.000Z","publication_date":"2017-05-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":5,"abstract":"A wiring substrate is provided with a support substrate (31), an insulating layer (32), and a wiring layer (33). The support substrate (31) is formed with a hole (34) including an opening portion in one surface of the support substrate (31). The insulating layer (32) is formed on a surface of the support substrate (31) opposite to the one surface thereof including the opening portion. The wiring layer (33) includes a wiring pattern of a predetermined structure on the insulating layer (32). Further, an orthographic projection to be obtained when the wiring pattern is projected on a predetermined surface of the support substrate (31), and an orthographic projection to be obtained when the hole (34) is projected on the predetermined surface of the support substrate (31) include a shared portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate and manufacturing method thereof","description":"A wiring substrate is provided with a support substrate (31), an insulating layer (32), and a wiring layer (33). The support substrate (31) is formed with a hole (34) including an opening portion in o","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9666542","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9666542","citation_suggestion":"Patentable. \"Wiring substrate and manufacturing method thereof\" (US-9666542). https://patentable.app/patents/US-9666542","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9666542","json":"https://patentable.app/api/llm-context/US-9666542","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T13:37:54.874Z"}