{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9666549","patent":{"patent_number":"US-9666549","title":"Methods for solder for through-mold interconnect","assignee":null,"inventors":[],"filing_date":"2015-10-09T00:00:00.000Z","publication_date":"2017-05-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"Generally discussed herein are systems and apparatuses that include an extended TSBA ball and techniques for making the same. According to an example, a technique can include forming a circuit substrate including forming a circuit on a substrate, the circuit exposed along an upper surface of the substrate, wherein the substrate is for coupling the circuit with a die along a lower surface of the circuit substrate. A molding can be formed onto an upper surface of the circuit substrate, over the circuit of the circuit substrate. An opening can be defined in the molding so that the opening can extend to a top surface of the molding to at least a portion of the circuit. Solder can be formed into the opening, including conforming the solder to the opening and the circuit substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods for solder for through-mold interconnect","description":"Generally discussed herein are systems and apparatuses that include an extended TSBA ball and techniques for making the same. According to an example, a technique can include forming a circuit substra","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9666549","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9666549","citation_suggestion":"Patentable. \"Methods for solder for through-mold interconnect\" (US-9666549). https://patentable.app/patents/US-9666549","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9666549","json":"https://patentable.app/api/llm-context/US-9666549","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:40:06.626Z"}