{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9668362","patent":{"patent_number":"US-9668362","title":"Multilayer printed circuit board and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2014-08-22T00:00:00.000Z","publication_date":"2017-05-30T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":1,"abstract":"When laminating two resin films so that sides where the conductive patterns are not formed face each other, and when laminating other resin films so that sides where the conductive patterns are formed and the sides where the conductive patterns are not formed to face each other, a plurality of resin films each of which has the same resin thickness are used for the other resin films, and two resin films having a sum of resin thickness that is the same as the resin thickness of the other single resin film are used for the two resin films. Accordingly, dielectric thicknesses between the conductive patterns formed in the adjoining resin films can be made even so that an impedance can be calculated easily, and it becomes possible to ease the circuit design."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multilayer printed circuit board and method of manufacturing the same","description":"When laminating two resin films so that sides where the conductive patterns are not formed face each other, and when laminating other resin films so that sides where the conductive patterns are formed","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9668362","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9668362","citation_suggestion":"Patentable. \"Multilayer printed circuit board and method of manufacturing the same\" (US-9668362). https://patentable.app/patents/US-9668362","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9668362","json":"https://patentable.app/api/llm-context/US-9668362","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:47:19.241Z"}