{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9671959","patent":{"patent_number":"US-9671959","title":"Tiered sub-unit throughputs in mass storage assemblies","assignee":null,"inventors":[],"filing_date":"2014-12-02T00:00:00.000Z","publication_date":"2017-06-06T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F","G06F"],"num_claims":16,"abstract":"Tiered mass storage assemblies are presented. The mass storage assembly in one example includes a plurality of drive interfaces configured to couple to a plurality of storage devices, with each drive interface of the plurality of drive interfaces being configured to exchange digital data at a predetermined maximum interface throughput, one or more low-output storage drives coupled to one or more corresponding drive interfaces, with a low-output storage drive exchanging digital data using the predetermined maximum interface throughput, and one or more high-output storage drives, with each high-output storage drive of the one or more high-output storage drives being coupled to two or more drive interfaces and with a high-output storage drive exchanging digital data using two or more predetermined maximum interface throughputs of the two or more drive interfaces."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Tiered sub-unit throughputs in mass storage assemblies","description":"Tiered mass storage assemblies are presented. The mass storage assembly in one example includes a plurality of drive interfaces configured to couple to a plurality of storage devices, with each drive ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9671959","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9671959","citation_suggestion":"Patentable. \"Tiered sub-unit throughputs in mass storage assemblies\" (US-9671959). https://patentable.app/patents/US-9671959","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9671959","json":"https://patentable.app/api/llm-context/US-9671959","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:23:08.690Z"}