{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9672323","patent":{"patent_number":"US-9672323","title":"Reduction of warpage of multilayered substrate or package","assignee":null,"inventors":[],"filing_date":"2016-03-31T00:00:00.000Z","publication_date":"2017-06-06T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F","G06F","G06F","G06F"],"num_claims":10,"abstract":"A method that minimizes adjustment of a wiring layer in reducing a warpage of a multilayered substrate and enables location of a part of a wiring layer that needs correction in order to reduce the warpage. The difference in average coefficient of thermal expansion, Δα, varies in a substrate. The method focuses in on the difference in Δα with a great length scale (low frequency) having a relatively significant effect on the warpage compared to the difference in Δα with a smaller length scale (high frequency) and corrects only the difference in Δα with a greater length scale. The distribution of the difference in Δα in a plane of substrate is determined. Then digital filtering is performed to extract only the difference in Δα with a low frequency and the difference in Δα between before and after correction, thereby revealing a part that requires correction."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Reduction of warpage of multilayered substrate or package","description":"A method that minimizes adjustment of a wiring layer in reducing a warpage of a multilayered substrate and enables location of a part of a wiring layer that needs correction in order to reduce the war","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9672323","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9672323","citation_suggestion":"Patentable. \"Reduction of warpage of multilayered substrate or package\" (US-9672323). https://patentable.app/patents/US-9672323","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9672323","json":"https://patentable.app/api/llm-context/US-9672323","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:41:18.793Z"}