{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9673061","patent":{"patent_number":"US-9673061","title":"Method for thermal process in packaging assembly of semiconductor","assignee":null,"inventors":[],"filing_date":"2015-06-02T00:00:00.000Z","publication_date":"2017-06-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A method for thermal process in packaging assembly of semiconductor is disclosed. The high-pressure overheated vapor is injected into the process chamber. The overheated vapor becomes saturated vapor in atmosphere (1 ATM) immediately and generates condensed liquid film onto all the surface of semiconductor work and also the chamber walls as condensation phenomenon occurs. The process temperature of vapor condensation is very close to and never exceeds the boiling point of perfluorinated compounds (PFC). Therefore, the latent heat of the saturated vapor is transferred to semiconductor work through the surface of liquid film evenly and uniformly."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for thermal process in packaging assembly of semiconductor","description":"A method for thermal process in packaging assembly of semiconductor is disclosed. The high-pressure overheated vapor is injected into the process chamber. The overheated vapor becomes saturated vapor ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9673061","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9673061","citation_suggestion":"Patentable. \"Method for thermal process in packaging assembly of semiconductor\" (US-9673061). https://patentable.app/patents/US-9673061","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9673061","json":"https://patentable.app/api/llm-context/US-9673061","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:39:09.650Z"}