{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9673066","patent":{"patent_number":"US-9673066","title":"Apparatus and method of manufacturing semiconductor package module","assignee":null,"inventors":[],"filing_date":"2016-01-04T00:00:00.000Z","publication_date":"2017-06-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"An apparatus for manufacturing a semiconductor package module and a method of manufacturing a semiconductor package are provided. The apparatus for manufacturing a semiconductor package module includes a lower mold installed thereon with a board with at least one element mounted thereon, an upper mold, in a state of accommodating the board, provided above the board, a filler supplier disposed in at least one of the upper mold and the lower mold, and supplying a filler to a molding space between the board and the upper mold, and a pattern forming member provided in an inner surface of the upper mold that provides an uneven pattern on a molded part."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Apparatus and method of manufacturing semiconductor package module","description":"An apparatus for manufacturing a semiconductor package module and a method of manufacturing a semiconductor package are provided. The apparatus for manufacturing a semiconductor package module include","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9673066","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9673066","citation_suggestion":"Patentable. \"Apparatus and method of manufacturing semiconductor package module\" (US-9673066). https://patentable.app/patents/US-9673066","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9673066","json":"https://patentable.app/api/llm-context/US-9673066","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:22:23.688Z"}