{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9673085","patent":{"patent_number":"US-9673085","title":"Method for manufacturing SOI wafer","assignee":null,"inventors":[],"filing_date":"2013-07-30T00:00:00.000Z","publication_date":"2017-06-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":11,"abstract":"The present invention provides a method for manufacturing an SOI wafer including a step of forming an insulator film on an entire surface of a bond wafer before bonding, bringing a bonded wafer before delaminating the bond wafer at an ion implanted layer into contact with a liquid that enables dissolving the insulator film while protecting the insulator film on a back surface on the opposite side of a bonding surface of the bond wafer, or exposing the bonded wafer to a gas that enables dissolving the insulator film, and thus etching the insulator film placed between the bond wafer and a base wafer from an outer peripheral end of the bonded wafer toward a center of the bonded wafer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for manufacturing SOI wafer","description":"The present invention provides a method for manufacturing an SOI wafer including a step of forming an insulator film on an entire surface of a bond wafer before bonding, bringing a bonded wafer before","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9673085","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9673085","citation_suggestion":"Patentable. \"Method for manufacturing SOI wafer\" (US-9673085). https://patentable.app/patents/US-9673085","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9673085","json":"https://patentable.app/api/llm-context/US-9673085","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:39:08.918Z"}