{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9673140","patent":{"patent_number":"US-9673140","title":"Package structure having a laminated release layer and method for fabricating the same","assignee":null,"inventors":[],"filing_date":"2015-02-12T00:00:00.000Z","publication_date":"2017-06-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A method for fabricating a package structure is provided, which includes the steps of: providing a carrier having a plurality of bonding pads; laminating a laminate on the carrier, wherein the laminate has a built-up portion and a release portion smaller in size than the built-up portion, the release portion covering the bonding pads and the built-up portion being laminated on the release portion and the carrier; forming a plurality of conductive posts in the built-up portion; and removing the release portion and the built-up portion on the release portion such that a cavity is formed in the laminate to expose the bonding pads, the conductive posts being positioned around a periphery of the cavity. Therefore, the present invention has simplified processes."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure having a laminated release layer and method for fabricating the same","description":"A method for fabricating a package structure is provided, which includes the steps of: providing a carrier having a plurality of bonding pads; laminating a laminate on the carrier, wherein the laminat","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9673140","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9673140","citation_suggestion":"Patentable. \"Package structure having a laminated release layer and method for fabricating the same\" (US-9673140). https://patentable.app/patents/US-9673140","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9673140","json":"https://patentable.app/api/llm-context/US-9673140","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:59:31.109Z"}