{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9673148","patent":{"patent_number":"US-9673148","title":"System in package","assignee":null,"inventors":[],"filing_date":"2015-11-03T00:00:00.000Z","publication_date":"2017-06-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"An electronic system without using solder balls between electrical components, and without using interposer between chips and package substrate, without using a discrete system board for the chip package to mount. A chip is wrapped by molding material, a first redistribution circuitry is built on a bottom side of the molding material; a second redistribution circuitry is built on a bottom side of the first redistribution circuitry. A third redistribution circuitry is built on a bottom side of the second redistribution circuitry. Plated metal vias are configured between each two of the electrical components."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"System in package","description":"An electronic system without using solder balls between electrical components, and without using interposer between chips and package substrate, without using a discrete system board for the chip pack","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9673148","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9673148","citation_suggestion":"Patentable. \"System in package\" (US-9673148). https://patentable.app/patents/US-9673148","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9673148","json":"https://patentable.app/api/llm-context/US-9673148","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:46:29.926Z"}