{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9673160","patent":{"patent_number":"US-9673160","title":"Packaging devices, methods of manufacture thereof, and packaging methods","assignee":null,"inventors":[],"filing_date":"2016-07-22T00:00:00.000Z","publication_date":"2017-06-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Packaging devices, methods of manufacture thereof, and packaging methods are disclosed. In some embodiments, a packaging device includes a first substrate including a post passivation interconnect (PPI) structure including a PPI pad disposed thereon, and a second substrate including a contact pad disposed thereon. A conductive bump is coupled between the PPI pad and the contact pad. A molding material is disposed over portions of the PPI structure proximate the conductive bump. A top surface of the molding material contacts the conductive bump at a height of the conductive bump having a width C, and the contact pad has a width B. A ratio R of C:B comprises about 1.0 or greater."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaging devices, methods of manufacture thereof, and packaging methods","description":"Packaging devices, methods of manufacture thereof, and packaging methods are disclosed. In some embodiments, a packaging device includes a first substrate including a post passivation interconnect (PP","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9673160","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9673160","citation_suggestion":"Patentable. \"Packaging devices, methods of manufacture thereof, and packaging methods\" (US-9673160). https://patentable.app/patents/US-9673160","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9673160","json":"https://patentable.app/api/llm-context/US-9673160","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:55:34.367Z"}