{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9673171","patent":{"patent_number":"US-9673171","title":"Integrated circuit packaging system with coreless substrate and method of manufacture thereof","assignee":null,"inventors":[],"filing_date":"2014-03-26T00:00:00.000Z","publication_date":"2017-06-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An integrated circuit packaging system and method of manufacture thereof includes: providing a semiconductor die having semiconductor die contacts; depositing an insulation layer on the semiconductor die including the semiconductor die contacts exposed; applying a conductive layer on the semiconductor die contacts and the insulation layer; and coupling system interconnects to the conductive layer for electrically connecting the semiconductor die to the system interconnects."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit packaging system with coreless substrate and method of manufacture thereof","description":"An integrated circuit packaging system and method of manufacture thereof includes: providing a semiconductor die having semiconductor die contacts; depositing an insulation layer on the semiconductor ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9673171","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9673171","citation_suggestion":"Patentable. \"Integrated circuit packaging system with coreless substrate and method of manufacture thereof\" (US-9673171). https://patentable.app/patents/US-9673171","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9673171","json":"https://patentable.app/api/llm-context/US-9673171","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:32:01.291Z"}