{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9673175","patent":{"patent_number":"US-9673175","title":"Heat spreader for package-on-package (PoP) type packages","assignee":null,"inventors":[],"filing_date":"2015-08-25T00:00:00.000Z","publication_date":"2017-06-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package-on-package (PoP) device has a first package and an interposer heat spreader. The first package includes a die and a substrate. The substrate has die contact pads, top contact pads, bottom contact pads, and interconnects between the die contact pads, the top contact pads, and the bottom contact pads. The die is electrically connected to the die contact pads. The top contact pads are adapted to be electrically connected to a second package to form the PoP device. The heat spreader has a central section thermo-conductively connected to the die. The heat spreader includes at least one arm connected to the central section and extending out past an edge of the first package. The heat spreader also has openings for electrical interconnects between the first package and the second package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heat spreader for package-on-package (PoP) type packages","description":"A package-on-package (PoP) device has a first package and an interposer heat spreader. The first package includes a die and a substrate. The substrate has die contact pads, top contact pads, bottom co","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9673175","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9673175","citation_suggestion":"Patentable. \"Heat spreader for package-on-package (PoP) type packages\" (US-9673175). https://patentable.app/patents/US-9673175","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9673175","json":"https://patentable.app/api/llm-context/US-9673175","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:15:12.228Z"}