{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9673182","patent":{"patent_number":"US-9673182","title":"Package on package bonding structure and method for forming the same","assignee":null,"inventors":[],"filing_date":"2016-07-07T00:00:00.000Z","publication_date":"2017-06-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of forming a package on package (PoP) structure includes forming a first die package, and bonding an external connector of a second die package to a solder paste layer of the first die package. The forming the first die package includes forming a contact pad over a substrate, attaching a metal ball with a convex surface to the contact pad, and applying a solder paste layer over a distal end of the metal ball and leaving at least a portion of the metal ball without solder paste. The forming the first die package also includes attaching a semiconductor die to the substrate, and forming a molding compound between the semiconductor die and the metal ball, where the solder paste layer has a first portion extending above an upper surface of the molding compound and a second portion extending below the upper surface of the molding compound."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package on package bonding structure and method for forming the same","description":"A method of forming a package on package (PoP) structure includes forming a first die package, and bonding an external connector of a second die package to a solder paste layer of the first die packag","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9673182","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9673182","citation_suggestion":"Patentable. \"Package on package bonding structure and method for forming the same\" (US-9673182). https://patentable.app/patents/US-9673182","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9673182","json":"https://patentable.app/api/llm-context/US-9673182","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:37:35.185Z"}