{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9673367","patent":{"patent_number":"US-9673367","title":"Substrate for mounting chip and chip package","assignee":null,"inventors":[],"filing_date":"2014-09-17T00:00:00.000Z","publication_date":"2017-06-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A chip mounting substrate including a plurality of conductive portions to apply an electrode voltage to a mounted chip having electrode portions, at least one insulation portion configured to electrically isolate conductive portions, a cavity depressed inward of the conductive portions and providing a space in which the chip is mounted and bumps formed on surfaces of the conductive portions having the cavity and bonded to the electrode portions. In the case of a metal substrate, a tight bonding is enabled between the chip and the substrate by bonding a plating layer formed on the electrode portions of the chip using bumps formed on the metal substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Substrate for mounting chip and chip package","description":"A chip mounting substrate including a plurality of conductive portions to apply an electrode voltage to a mounted chip having electrode portions, at least one insulation portion configured to electric","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9673367","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9673367","citation_suggestion":"Patentable. \"Substrate for mounting chip and chip package\" (US-9673367). https://patentable.app/patents/US-9673367","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9673367","json":"https://patentable.app/api/llm-context/US-9673367","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:24:15.475Z"}