{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9674955","patent":{"patent_number":"US-9674955","title":"Tape carrier package, method of manufacturing the same and chip package","assignee":null,"inventors":[],"filing_date":"2012-11-06T00:00:00.000Z","publication_date":"2017-06-06T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":4,"abstract":"Provided are a tape carrier package and a method of manufacturing the same, the method, including: forming through holes by performing a drill process using a laser to an insulating film of a flexible copper clad laminate (FCCL) film consisting of the insulating film and a copper layer; forming a circuit pattern layer by performing an etching process to the copper layer of the FCCL film; and selectively forming a plating layer on the circuit pattern layer. The method of manufacturing the tape carrier package according to the present invention is advantageous because a punching process, and processes for laminating and drying the copper layer which are necessary for the conventional method of manufacturing the tape carrier package can be omitted, a production cost of the tape carrier package is reduced, and the time required for the drying process is saved."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Tape carrier package, method of manufacturing the same and chip package","description":"Provided are a tape carrier package and a method of manufacturing the same, the method, including: forming through holes by performing a drill process using a laser to an insulating film of a flexible","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9674955","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9674955","citation_suggestion":"Patentable. \"Tape carrier package, method of manufacturing the same and chip package\" (US-9674955). https://patentable.app/patents/US-9674955","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9674955","json":"https://patentable.app/api/llm-context/US-9674955","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:26:41.278Z"}