{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9676193","patent":{"patent_number":"US-9676193","title":"Substrate processing method and method of manufacturing substrate for liquid discharge head including forming hole in substrate by dry etching","assignee":null,"inventors":[],"filing_date":"2015-05-08T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":10,"abstract":"A substrate processing method includes forming a first hole in a first surface of a silicon substrate to have a depth that it does not extend through the substrate and forming a second hole in a second surface to make the second hole to communicate with the first hole, so that a through hole formed of the first and second holes is formed in the substrate. The process of forming the second hole includes forming a communication portion wider than an opening of the first hole between the first and second holes after the second hole has been made to communicate with the first hole by dry etching."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Substrate processing method and method of manufacturing substrate for liquid discharge head including forming hole in substrate by dry etching","description":"A substrate processing method includes forming a first hole in a first surface of a silicon substrate to have a depth that it does not extend through the substrate and forming a second hole in a secon","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9676193","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9676193","citation_suggestion":"Patentable. \"Substrate processing method and method of manufacturing substrate for liquid discharge head including forming hole in substrate by dry etching\" (US-9676193). https://patentable.app/patents/US-9676193","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9676193","json":"https://patentable.app/api/llm-context/US-9676193","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:09:09.437Z"}