{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9676968","patent":{"patent_number":"US-9676968","title":"Heat-resistant adhesive sheet for semiconductor inspection and semiconductor inspection method","assignee":null,"inventors":[],"filing_date":"2015-05-11T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A heat resistant adhesive sheet is provided that does not easily develop deformation of an adhesive sheet due to heating. Such an adhesive sheet made by laminating an adhesive layer to a substrate is provided, characterized in that the substrate is heat shrinkable and the adhesive layer contains a (meth)acrylate copolymer, a photopolymerizable compound, a polyfunctional isocyanate curing agent, and a photopolymerization initiator and does not substantially contain a tackifying resin. This adhesive sheet is not deformed even when heated. Since the adhesive does not substantially contain a tackifying resin, softening of the adhesive layer does not occur even when the sheet is heated."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heat-resistant adhesive sheet for semiconductor inspection and semiconductor inspection method","description":"A heat resistant adhesive sheet is provided that does not easily develop deformation of an adhesive sheet due to heating. Such an adhesive sheet made by laminating an adhesive layer to a substrate is ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9676968","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9676968","citation_suggestion":"Patentable. \"Heat-resistant adhesive sheet for semiconductor inspection and semiconductor inspection method\" (US-9676968). https://patentable.app/patents/US-9676968","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9676968","json":"https://patentable.app/api/llm-context/US-9676968","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:33:07.112Z"}