{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9677820","patent":{"patent_number":"US-9677820","title":"Electronic device and liquid cooling heat dissipation structure thereof","assignee":null,"inventors":[],"filing_date":"2015-05-11T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["G06F","H01L","G06F"],"num_claims":16,"abstract":"A liquid cooling heat dissipation structure includes a heat-conducting substrate, a fluid-splitting board, a fluid-conducting board, and a liquid supply module. The heat-conducting substrate has a heat-conducting body contacting a heat generation source and a plurality of heat-dissipating fins disposed on the heat-conducting body. The fluid-splitting board is disposed on the heat-dissipating fins. The fluid-conducting board is disposed on the fluid-splitting board. The liquid supply module includes an external cover body detachably disposed on the heat-conducting body and at least two pumps detachably disposed on the external cover body. The external cover body has at least one liquid inlet and at least one liquid outlet, and cooling liquid flows into the external cover body through the at least one liquid inlet and flows out of the external cover body through the at least one liquid outlet by driving one or all of the at least two pumps."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic device and liquid cooling heat dissipation structure thereof","description":"A liquid cooling heat dissipation structure includes a heat-conducting substrate, a fluid-splitting board, a fluid-conducting board, and a liquid supply module. The heat-conducting substrate has a hea","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9677820","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9677820","citation_suggestion":"Patentable. \"Electronic device and liquid cooling heat dissipation structure thereof\" (US-9677820). https://patentable.app/patents/US-9677820","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9677820","json":"https://patentable.app/api/llm-context/US-9677820","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:40:02.252Z"}