{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9678271","patent":{"patent_number":"US-9678271","title":"Packaged opto-electronic module","assignee":null,"inventors":[],"filing_date":"2015-01-26T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H04B","H01L","H01L","H01L"],"num_claims":20,"abstract":"A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits that modulate data, communicate data, and serialize/deserialize data, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and a top surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit. Furthermore, a bottom surface of the optical integrated circuit faces the top surface of the interposer, and the front surface of the optical integrated circuit is optically coupled to an optical-fiber receptacle, which in turn is optically coupled to an optical-fiber connector."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaged opto-electronic module","description":"A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit inclu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9678271","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9678271","citation_suggestion":"Patentable. \"Packaged opto-electronic module\" (US-9678271). https://patentable.app/patents/US-9678271","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9678271","json":"https://patentable.app/api/llm-context/US-9678271","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:51:08.315Z"}