{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9679188","patent":{"patent_number":"US-9679188","title":"Fingerprint sensor packaging module and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2016-01-08T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["G06V","G06V","H01L"],"num_claims":12,"abstract":"A fingerprint sensor packaging module includes a light-pervious cover layer, a conductive pattern layer on the light-pervious cover layer, a finger sensing chip on the conductive pattern layer, a circuit board on the light-pervious cover layer, and a package member. The conductive pattern layer includes a plurality of pads. The fingerprint sensing chip is electrically connected to the conductive pattern layer by contacting to the pads. The circuit board is electrically connected to the conductive pattern layer and has a hole and the hole exposes the fingerprint sensing chip. The fingerprint sensing chip is disposed in the hole. The package member disposed in the hole and at least cover the fingerprint sensing chip."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fingerprint sensor packaging module and manufacturing method thereof","description":"A fingerprint sensor packaging module includes a light-pervious cover layer, a conductive pattern layer on the light-pervious cover layer, a finger sensing chip on the conductive pattern layer, a circ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9679188","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9679188","citation_suggestion":"Patentable. \"Fingerprint sensor packaging module and manufacturing method thereof\" (US-9679188). https://patentable.app/patents/US-9679188","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9679188","json":"https://patentable.app/api/llm-context/US-9679188","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:21:04.900Z"}