{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9679786","patent":{"patent_number":"US-9679786","title":"Packaging module of power converting circuit and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2016-02-24T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"The disclosure discloses a packaging module of a power converting circuit and a method for manufacturing the same. The packaging module of the power converting circuit includes a substrate, a molding layer and a plurality of pins. A power device is assembled at the substrate, a plurality of pins electrically are coupled to the power device, the molding layer covers the surface of the substrate with the power device, and at least a contact surface of the pins configured to electrically connect an external circuit is exposed. The molding layer includes a main hat-body part and a hat-brim part, the main hat-body part and the hat-brim part form a hat-shaped molding layer, and the hat-brim part is used to increase a creepage distance between the contact surfaces of the pins located at the top of the molding layer and the bottom of the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaging module of power converting circuit and method for manufacturing the same","description":"The disclosure discloses a packaging module of a power converting circuit and a method for manufacturing the same. The packaging module of the power converting circuit includes a substrate, a molding ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9679786","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9679786","citation_suggestion":"Patentable. \"Packaging module of power converting circuit and method for manufacturing the same\" (US-9679786). https://patentable.app/patents/US-9679786","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9679786","json":"https://patentable.app/api/llm-context/US-9679786","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:20:15.881Z"}