{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9679789","patent":{"patent_number":"US-9679789","title":"Wafer processing apparatus","assignee":null,"inventors":[],"filing_date":"2014-12-01T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":3,"abstract":"A wafer in which a modified layer is internally formed along planned dividing lines is placed on a placement table and a water tank allows the wafer placed on the placement table to be submerged in cleaning water. An ultrasonic supply unit supplies ultrasonic waves to the wafer submerged in the cleaning water. By the ultrasonic waves supplied by the ultrasonic supply unit, the wafer is divided along the planned dividing lines and is turned into small pieces to generate plural chips and the generated chips are cleaned."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer processing apparatus","description":"A wafer in which a modified layer is internally formed along planned dividing lines is placed on a placement table and a water tank allows the wafer placed on the placement table to be submerged in cl","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9679789","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9679789","citation_suggestion":"Patentable. \"Wafer processing apparatus\" (US-9679789). https://patentable.app/patents/US-9679789","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9679789","json":"https://patentable.app/api/llm-context/US-9679789","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:15:11.601Z"}