{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9679806","patent":{"patent_number":"US-9679806","title":"Nanowires for pillar interconnects","assignee":null,"inventors":[],"filing_date":"2016-06-24T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"An embodiment of the invention may include a semiconductor structure, and method of forming the semiconductor structure. The semiconductor structure may include a first set of pillars located on a first substrate. The semiconductor structure may include a second set of pillars located on a second substrate. The semiconductor structure may include a joining layer connecting the first pillar to the second pillar. The semiconductor structure may include an underfill layer located between the first and second substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Nanowires for pillar interconnects","description":"An embodiment of the invention may include a semiconductor structure, and method of forming the semiconductor structure. The semiconductor structure may include a first set of pillars located on a fir","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9679806","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9679806","citation_suggestion":"Patentable. \"Nanowires for pillar interconnects\" (US-9679806). https://patentable.app/patents/US-9679806","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9679806","json":"https://patentable.app/api/llm-context/US-9679806","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:17:04.259Z"}