{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9679826","patent":{"patent_number":"US-9679826","title":"Method for fabricating semiconductor package with stator set formed by circuits","assignee":null,"inventors":[],"filing_date":"2016-06-10T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":3,"abstract":"A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator set formed by circuits; an axial tube axially installed in the via of the substrate; a plurality of electronic components mounted on the top surface of the substrate and electrically connected to the substrate; an encapsulant formed on the top surface of the substrate for encapsulating the electronic components and the axial tube; and an impeller axially coupled to the axial tube via the bottom surface of the substrate. In the semiconductor package, the stator set is formed in the substrate by a patterning process. Therefore, the thickness of the semiconductor package is reduced significantly."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for fabricating semiconductor package with stator set formed by circuits","description":"A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator se","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9679826","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9679826","citation_suggestion":"Patentable. \"Method for fabricating semiconductor package with stator set formed by circuits\" (US-9679826). https://patentable.app/patents/US-9679826","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9679826","json":"https://patentable.app/api/llm-context/US-9679826","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:41:11.257Z"}