{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9679830","patent":{"patent_number":"US-9679830","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2015-08-19T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":4,"abstract":"A semiconductor package includes a packaging substrate having a first surface and a second surface opposite to the first surface; and a semiconductor die assembled on the first surface of the packaging substrate. The semiconductor die includes a plurality of first bump pads and second bump pads on an active surface of the semiconductor die, a plurality of first copper pillars on the first bump pads, and a plurality of second copper pillars on the second bump pads. The first copper pillars have a diameter that is smaller than that of the second copper pillars."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package","description":"A semiconductor package includes a packaging substrate having a first surface and a second surface opposite to the first surface; and a semiconductor die assembled on the first surface of the packagin","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9679830","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9679830","citation_suggestion":"Patentable. \"Semiconductor package\" (US-9679830). https://patentable.app/patents/US-9679830","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9679830","json":"https://patentable.app/api/llm-context/US-9679830","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:36:00.793Z"}