{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9679842","patent":{"patent_number":"US-9679842","title":"Semiconductor package assembly","assignee":null,"inventors":[],"filing_date":"2015-06-17T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package and a second semiconductor package stacked on the first semiconductor package. The first semiconductor package includes a first redistribution layer (RDL) structure. A first semiconductor die is coupled to the first RDL structure. A first molding compound surrounds the first semiconductor die, and is in contact with the RDL structure and the first semiconductor die. The second semiconductor package includes a second redistribution layer (RDL) structure. A first dynamic random access memory (DRAM) die without through silicon via (TSV) interconnects formed passing therethrough is coupled to the second RDL structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package assembly","description":"The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package and a second semiconductor package stacked on the first semiconductor","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9679842","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9679842","citation_suggestion":"Patentable. \"Semiconductor package assembly\" (US-9679842). https://patentable.app/patents/US-9679842","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9679842","json":"https://patentable.app/api/llm-context/US-9679842","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:14:53.076Z"}