{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9679855","patent":{"patent_number":"US-9679855","title":"Polymer crack stop seal ring structure in wafer level package","assignee":null,"inventors":[],"filing_date":"2016-03-28T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":21,"abstract":"Some implementations provide a semiconductor device (e.g., die, wafer) that includes a substrate, that is configured with trenches that are dry-etched into a surface of the substrate inside an area defined by scribe lines of the substrate. A crack stop structure is provided for the semiconductor device that includes a polymer dielectric layer coating that fills the trenches with a polymer dielectric material and provides a dielectric layer over the surface of the substrate inside the area. The polymer dielectric layer coating and trenches are configured to reduce cracking or chipping of the substrate in the area defined by scribe lines after cutting."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Polymer crack stop seal ring structure in wafer level package","description":"Some implementations provide a semiconductor device (e.g., die, wafer) that includes a substrate, that is configured with trenches that are dry-etched into a surface of the substrate inside an area de","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9679855","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9679855","citation_suggestion":"Patentable. \"Polymer crack stop seal ring structure in wafer level package\" (US-9679855). https://patentable.app/patents/US-9679855","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9679855","json":"https://patentable.app/api/llm-context/US-9679855","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:04:47.733Z"}